6 Layer Half Hole PCB 0.8 MM Thickness S1000-2 Material TG170
Board Info:
1 Part NO: Half hole PCB0014
2 Layer Count: 6 Layer PCB
3 Finished Board Thickness: 0.8MM tolerance is +/-0.1MM
4 Copper Thickness: 1/1/1/1/1/1OZ
5 PCB Size: 106mm*91mm/6pcs
6 Application Area: Bluetooth Module
Our Capabilities:
| NO |
Item |
Capability |
| 1 |
Layer Count |
1-24 Layers |
| 2 |
Board Thickness |
0.1mm-6.0mm |
| 3 |
Finished Board Max Size |
700mm*800mm |
| 4 |
Finished Board Thickness Tolerance |
+/-10% +/-0.1(<1.0mm) |
| 5 |
Warp |
<0.7% |
| 6 |
Major CCL Brand |
KB/NanYa/ITEQ/ShengYi/Rogers Etc |
| 7 |
Material Type |
FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET |
| 8 |
Drill Hole Diameter |
0.1mm-6.5mm |
| 9 |
Out Layer Copper Thickness |
1/2OZ-8OZ |
| 10 |
Inner Layer Copper Thickness |
1/3OZ-6OZ |
| 11 |
Aspect Ratio |
10:1 |
| 12 |
PTH Hole Tolerance |
+/-3mil |
| 13 |
NPTH Hole Tolerance |
+/-1mil |
| 14 |
Copper Thickness of PTH Wall |
>10mil(25um) |
| 15 |
Line Width And Space |
2/2mil |
| 16 |
Min Solder Mask Bridge |
2.5mil |
| 17 |
Solder Mask Alignment Tolerance |
+/-2mil |
| 18 |
Dimension Tolerance |
+/-4mil |
| 19 |
Max Gold Thickness |
200u'(0.2mil) |
| 20 |
Thermal Shock |
288℃, 10s, 3 times |
| 21 |
Impedance Control |
+/-10% |
| 22 |
Test Capability |
PAD Size min 0.1mm |
| 23 |
Min BGA |
7mil |
| 24 |
Surface Treatment |
OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc |
Packing Specifications:
1 One vacuum pcb package should not be over 25 panels based on panel size.
2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.
3 The pcb package must be suitable to ensure effective vacuum sealing.
4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.
5 Humidity indicator card target less than 10%.
Product Tags:
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TG170 6 Layer Half Hole PCB 0.8 MM S1000-2 Fr4 Printed Circuit Board Images
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